Zhang, Z., Zhang, Y., Luo, Y., Lv, G., Yin, J., Tan, P. and Duan, G. 2026. Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips. Nano-Micro Letters. 18, (Jan. 2026), 221. DOI:https://doi.org/10.1007/s40820-026-02080-4.