ZHANG, Z.; ZHANG, Y.; LUO, Y.; LV, G.; YIN, J.; TAN, P.; DUAN, G. Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips. Nano-Micro Letters, [S. l.], v. 18, p. 221, 2026. DOI: 10.1007/s40820-026-02080-4. Disponível em: https://www.nmlett.org/index.php/nml/article/view/2364. Acesso em: 28 jan. 2026.