YANG, R.; QI, L.; WU, X.; LIU, Z.; BIAN, H.; XIA, C.; MEI, C.; JIANG, S.; YAO, M.; LI, J. Eco-Friendly, Multi-Mode Processable Highly Moldable Wood Enabled by the Reconstruction of Hydrogen-Bonding Domain. Nano-Micro Letters, [S. l.], v. 18, p. 269, 2026. DOI: 10.1007/s40820-026-02121-y. Disponível em: https://www.nmlett.org/index.php/nml/article/view/2414. Acesso em: 5 mar. 2026.