JIANG, Y.; CHEN, Z.; SUN, X.; LI, H.; XIE, J.; LI, Y.; NIE, X.; LAN, F.; ZHANG, Y.; WEN, Q. Rheologically Engineered 3D-Printed Highly Loaded Magneto-Dielectric Absorbers for Device-Level Electromagnetic Compatibility. Nano-Micro Letters, [S. l.], v. 19, p. 13, 2026. DOI: 10.1007/s40820-026-02312-7. Disponível em: https://www.nmlett.org/index.php/nml/article/view/2613. Acesso em: 31 jul. 2026.