Yang, R., L. Qi, X. Wu, Z. Liu, H. Bian, C. Xia, C. Mei, S. Jiang, M. Yao, and J. Li. “Eco-Friendly, Multi-Mode Processable Highly Moldable Wood Enabled by the Reconstruction of Hydrogen-Bonding Domain”. Nano-Micro Letters, vol. 18, Mar. 2026, p. 269, doi:10.1007/s40820-026-02121-y.